Rabbit 4000 Microprocessor
User's Manual
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28. Specifications

28.1 DC Characteristics

Table 28-1. Preliminary DC Electrical Characteristics

Parameter

Symbol

Min

Typ

Max

Operating Temperature
TA
-40°C
85°C
Storage Temperature
-55°C
125°C
Core
Core Supply Voltage
VDDCORE
1.65 V
1.8 V
1.90 V
Core Current @ 29.4912 MHz, 25°C
ICORE
6.0 mA
Core current @ 7.3728 MHz, 25°C
3.7 mA
Core current @ 32.768 kHz, 25°C
22 µA
I/O Ring
I/O Ring Supply Voltage, 3.3 V
VDDIO
3.0 V
3.3 V
3.6 V
I/O Ring Supply Voltage, 1.8 V
1.65 V
1.8 V
1.90 V
I/O Ring Current @ 29.4912 MHz, 3.3 V, 25°C
IIO
12.2 mA
I/O Ring Current @ 7.3728 MHz, 3.3 V, 25°C
10.5 mA
I/O Ring Current @ 32.768 kHz, 3.3 V, 25°C
1.1 mA
Input Low Voltage (VDDIO = 3.3 V)
VIL
0.8 V
Input High Voltage (VDDIO = 3.3 V)
VIH
2.0 V
Output Low Voltage (VDDIO = 3.3 V)
VOL
0.4 V
Output High Voltage (VDDIO = 3.3 V)
VOH
2.4 V
Output drive
(TXD+, TXDD+, TXD-, TXDD-)
All other I/O
IDRIVE
24 mA
8 mA

Table 28-2. Preliminary Battery-Backed DC Electrical Characteristics
(VDDCORE = 1.8V ± 10%, VDDIO = 3.3V ± 10%, TA = -40°C to 85°C)

Parameter

Symbol

Min

Typ

Max

VBAT
VBAT Supply Voltage
VBAT
1.65 V
1.8 V
1.90 V
VBAT Current (device powered down)
IVBAT
1.7 µA
2.7 µA
VBATIO
VBATIO Supply Voltage
(device powered)
(device powered down)
VBATIO
1.65 V
1.65 V
3.3 V
1.8 V
3.6 V
3.6 V
VBATIO Current (device powered down)
IVBATIO
0.1 µA
0.2 µA


28.2 AC Characteristics

Table 28-3. Preliminary AC Electrical Characteristics
(VDDCORE = 1.8 V ± 10%, VDDIO = 3.3 V ± 10%, TA = -40°C to 85°C)

Parameter

Symbol

Min

Typ

Max

Main Clock Frequency on CLKI
fmain
60 MHz
Real-Time Clock Frequency on CLK32K
fRTC
32.768 kHz
Ethernet Clock Frequency on PE6
fEth
20 MHz


28.3 Memory Access Times

All access time measurements are taken at 50% of signal height.

28.3.1 Memory Reads

Table 28-4. Preliminary Memory Read Time Delays
(VDDCORE = 1.8 V ± 10%, VDDIO = 3.3 V ± 10%, TA = -40°C to 85°C)

Parameter

Symbol

Loading

Min

Typ

Max

Clock to Address Delay
Tadr
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to Memory Chip Select Delay
TCSx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to Memory Read Strobe Delay
TOEx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Data Setup Time
Tsetup
-
1 ns
Data Hold Time
Thold
-
0 ns


28.3.2 Memory Writes

Table 28-5. Preliminary Memory Write-Time Delays
(VDDCORE = 1.8 V ± 10%, VDDIO = 3.3 V ± 10%, TA = -40°C to 85°C)

Parameter

Symbol

Loading

Min

Typ

Max

Clock to Address Delay
Tadr
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to Memory Chip Select Delay
TCSx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to Memory Write Strobe Delay
TWEx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
High Z to Data Valid Relative to Clock
TDVHZ
30 pF
10 ns
60 pF
12 ns
90 pF
15 ns
Data Valid to High Z Relative to Clock
TDVHZ
30 pF
10 ns
60 pF
12 ns
90 pF
15 ns



Figure 28-1. Memory Read and Write Cycles


Figure 28-2. Memory Read and Write Cycles—Early
Output Enable and Write Enable Timing

28.3.3 External I/O Reads

Table 28-6. Preliminary External I/O Read Time Delays
(VDDCORE = 1.8 V ± 10%, VDDIO = 3.3 V ± 10%, TA = -40°C to 85°C)

Parameter

Symbol

Loading

Min

Typ

Max

Clock to Address Delay
Tadr
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to Memory Chip Select Delay
TCSx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to I/O Chip Select Delay
TIOCSx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to I/O Read Strobe Delay
TIORD
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to I/O Buffer Enable Delay
TBUFEN
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Data Setup Time
Tsetup
-
1 ns
Data Hold Time
Thold
-
1 ns


28.3.4 External I/O Writes

Table 28-7. Preliminary External I/O Write Time Delays
(VDDCORE = 1.8 V ± 10%, VDDIO = 3.3 V ± 10%, TA = -40°C to 85°C)

Parameter

Symbol

Loading

Min

Typ

Max

Clock to Address Delay
Tadr
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to Memory Chip Select Delay
TCSx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to I/O Chip Select Delay
TIOCSx
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to I/O Write Strobe Delay
TIOWR
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
Clock to I/O Buffer Enable Delay
TBUFEN
30 pF
6 ns
60 pF
8 ns
90 pF
11 ns
High Z to Data Valid Relative to Clock
TDVHZ
30 pF
10 ns
60 pF
12 ns
90 pF
15 ns
Data Valid to High Z Relative to Clock
TDVHZ
30 pF
10 ns
60 pF
12 ns
90 pF
15 ns


Figure 28-3. I/O Read and Write Cycles—No Extra Wait States

NOTE /IOCSx can be programmed to be active low (default) or active high.

28.3.5 Memory Access Times

In computing memory requirements, the important considerations are the address access time, output-enable access time, and minimum write-pulse required. Increasing the clock doubler delay increases the output-enable time, but decreases the memory write-pulse width. The early write-pulse option can be used to ensure a long-enough write pulse, but then it must be ensured that the write pulse does not begin before the address lines have stabilized.

The clock doubler has an affect on the memory access times. It works by ORing the clock with a delayed version of itself. The nominal delay varies from 3 to 20 ns, and is set under program control. Any asymmetry in the main clock input before it is doubled will result in alternate clocks having slightly different periods. Using the suggested oscillator circuit, the asymmetry is no worse than 52%–48%. This results in a given clock being shortened by the ratio 50/52, or 4% worst-case. The memory access time is not normally affected because the memory bus cycle is two clocks long and includes both a long and a short clock, resulting in no net change arising from asymmetry. However, if an odd number of wait states is used, then the memory access time will be affected slightly.

When the clock spectrum spreader is enabled, clock periods are shortened by a small amount, depending on whether the "normal" or the "strong" spreader setting is used, and depending on the operating voltage. If the clock doubler is used, the spectrum spreader affects every other cycle and reduces the clock high time. If the doubler is not used, then the spreader affects every clock cycle, and the clock low time is reduced. Of course, the spectrum spreader also lengthens clock cycles, but only the worst-case shortening is relevant for calculating worst-case access times. The numbers given for clock shortening with the doubler disabled are the combined shortening for two consecutive clock cycles, worst case.

The required memory address and output-enable access time for some typical clock speeds are given in Table 28-8 below. It is assumed that the clock doubler is used, that the clock spreader is enabled in the normal mode, that the memory early output-enable is on, and that the address bus has a load of 60 pF.

Table 28-8. Preliminary Memory Requirements
(VDDCORE = 1.8 V ± 10%, VDDIO = 3.3 V ± 10%, TA = -40°C to 85°C,
address bus loading = 60 pF)

Clock Frequency
(MHz)

Period

(ns)

Clock Doubler Nominal Delay
(ns)

Memory Address Access
(ns)

Memory Output- Enable Access
(ns)

22.11
45
20
78
51
29.49
34
16
56
36
44.24
22.5
10
33.5
22
58.98
17
6
22
19


All important signals on the Rabbit 4000 are output-synchronized with the internal clock. The internal clock is closely synchronized with the external clock, which is available on the CLK pin. The delay in signal output depends on the capacitive load on the output lines. In the case of the address lines, which are critically important for establishing memory access time requirements, the capacitive loading is usually in the range of 25–100 pF, and the load is due to the input capacitance of the memory devices and PC trace capacitance.

Delays are expressed from the waveform midpoint in keeping with the convention used by memory manufacturers.

Table 28-9 lists the delays in gross memory access time for several values of VDDIO.

Table 28-9. Preliminary Data and Clock Delays
(VDD ±10%, Temp. -40°C to 85°C)

VDDIO
(V)

Clock to Address Output Delay
(ns)

Data Setup Time Delay
(ns)

Worst-Case
Spectrum Spreader Delay
(ns)

30 pF

60 pF

90 pF

0.5 ns setting
no dbl / dbl

1 ns setting
no dbl / dbl

2 ns setting
no dbl / dbl

3.3
6
8
11
1
2.3 / 2.3
3 / 4.5
4.5 / 9
1.8
18
24
33
3
7 / 6.5
8 / 12
11 / 22


When the spectrum spreader is enabled with the clock doubler, every other clock cycle is shortened or lengthened by a maximum amount given in the table above. The shortening takes place by shortening the high part of the clock. If the doubler is not enabled, then every clock is shortened during the low part of the clock period. The maximum shortening for a pair of clocks combined is shown in the table.

The gross memory access time is 2T, where T is the clock period. To calculate the actual memory access time, subtract the clock to address output time, the data in setup time, and the clock period shortening due to the clock spectrum spreader from 2T.

Example Memory Access Time Calculation

The access time is given by

access time = 2T - (clock to address) - (data setup) - (spreader delay)
= 68 ns - 8 ns - 1 ns - 3 ns
= 56 ns

Similarly, the gross output-enable access time is T + minimum clock low time (it is assumed that the early output enable option is enabled). This is reduced by the spectrum spreader loss, the time from clock to output for the output enable signal, the data setup time, and a correction for the asymmetry of the original oscillator clock.

Example Output-Enable Access Time Calculation

NOTE There is some process and temperature variation in the clock doubler settings. As a rule of thumb, a 20% variation should be considered. When the doubler is enabled, 80% of the nominal value should be used for the memory access time calculation.

The output enable access time is given by

access time = T + (min. clock low) - (clock to output enable) -
(spreader delay) - (asymmetry delay) - (data setup time)
= 34 ns + 12.8 ns - 5 ns - 4.5 ns - 1.4 ns
= 36 ns

28.4 Clock Speeds

28.4.1 Recommended Clock/Memory Configurations

The preferred configuration for a Rabbit-based system is to use an external crystal or resonator that has a frequency one-half of the maximum internal clock frequency. The oscillator frequency can be doubled or divided by 2, 4, 6, or 8, giving a variety of operating speeds from the same crystal frequency. In addition, the 32.768 kHz oscillator that drives the battery-backable clock can be used as the main processor clock and, to save the substantial power consumed by the fast oscillator, the fast oscillator can be turned off. This scenario is called the sleepy mode, where the clock speed is from 2 kHz to 32 kHz, and the operating system current consumption of 10 to 120 µA depends on frequency and voltage.

Table 28-10 describes some recommended clock and memory configurations for both 8-bit and 16-bit memory devices. Optimal configurations for using 15 ns, 45–55 ns, and 70 ns memories are shown. Note that there is always at least one wait state in the 16-bit mode.

Table 28-10. Recommended Clock/Memory Configurations

Input Frequency (MHz)

Internal Frequency
(MHz)

Recommended Memory Setup

Use

SRAM

Flash

29.4912
58.9824
8 bits, 15 ns,
0 wait states
8 bits, 45–55 ns,
2 wait states
Fastest 8-bit configuration without wait states
(run code from SRAM)
22.1184
44.2368
16 bits, 45–55 ns,
1 wait state
16 bits, 45–55 ns,
1 wait state
Fastest 16-bit, 55 ns configuration without additional wait states
8 bits, 15 ns,
0 wait states
8 bits, 45–55 ns,
1 wait state
Fastest 8-bit, 55 ns configuration with 1 wait state
(run code in SRAM)
18.4320
36.8640
16 bits, 70 ns,
1 wait state
16 bits, 70 ns,
1 wait state
Fastest 16-bit, 70 ns configuration without additional wait states
14.7456
29.4912
8 bits, 45–55 ns,
0 wait states
8 bits, 45–55 ns,
0 wait states
Fastest 8-bit, 55 ns configuration without wait states
11.0592
22.1184
8 bits, 70 ns,
0 wait states
8 bits, 70 ns,
0 wait states
Fastest 8-bit, 70 ns configuration without wait states


The Rabbit 4000 is rated for a minimum clock period of 16 ns for both commercial and industrial specifications (preliminary). The commercial rating calls for a ±5% voltage variation from 3.3 V, and a temperature range from -40 to + 70°C. The industrial ratings stretch the voltage variation to ±10% over a temperature range from -40 to + 85°C. This corresponds to maximum clock frequencies of about 60 MHz (commercial or industrial). If the clock doubler or spectrum spreader is used, these maximum ratings must be reduced as shown in Table 28-11.

Table 28-11. Preliminary Maximum Clock Speeds
(VDD ±10%, Temp. -40°C to +85°C)

Conditions

Industrial Ratings

Duty Cycle Requirements
(ns)

Minimum Period
(ns)

Maximum Frequency (MHz)

No Doubler or Spreader
17
58.8

Spreader Only Normal
20
50.0

Spreader Only Strong
21
47.6

Doubler Only
(8 ns delay)
19
52.6
1 > (clock low - clock high) > 0
Doubler Only (internal 50% clock)
20
50
1 > (clock low - clock high) > -1
Spreader Normal with Doubler
(8 ns delay)
21
47.6
4 > (clock low - clock high) > 2
Spreader Normal with Doubler (8 ns delay), Internal 50% Clock
24
41.6
1 > (clock low - clock high) > -1
Spreader Only Strong
21.5
46.5

Spreader Strong with Doubler
(8 ns delay)
23
43.5
8 > (clock low - clock high) > 6


When the doubler is used, the duty cycle of the clock becomes a critical parameter. The duty cycle should be measured at the separate clock output pin (pin 2). The minimum period must be increased by any amount that the clock high time is greater or less than specified in the duty-cycle requirement.

For example, consider a design where the spreader and doubler are enabled, with 8 ns nominal delay in the doubler. The high and low clock are equal to within 1 ns. This violates the duty cycle requirement by 3 ns since (clock low - clock high) can be as small as -1 ns, but the requirement is that it not be less than 2 ns. Thus, 3 ns must be added to the minimum period of 21 ns, giving a minimum period of 24 ns and a maximum frequency of 41.6 MHz (commercial).

Since the built-in high-speed oscillator buffer generates a clock that is very close to having a 50% duty cycle, to obtain the highest clock speeds using the clock doubler you must use an external oscillator buffer that will allow for duty-cycle adjustment by changing the resistance of the power and ground connections as shown below.


Figure 28-4. External Oscillator Buffer

28.5 Power and Current Consumption

Various mechanisms contribute to the current consumption of the Rabbit 4000 processor while it is operating, including current that is proportional to the voltage alone (leakage current) and dependent on both voltage and frequency (switching and crossover current). To reduce current consumption, the clock can be divided down in one of the sleepy modes; see Table 26-1 for more details.

Figure 28-5 shows a typical current draw as a function of the main clock frequency. The values shown do not include any current consumed by external oscillators or memory. It is assumed that approximately 30 pF is connected to each address line.


Figure 28-5. Typical Current Draw as a Function of the Main Clock Frequency

28.5.1 Sleepy Mode Current Consumption

The Rabbit 4000 supports designs with very low power consumption by using features such as the ultra-sleepy modes and self-timed chip selects. At the low frequencies possible in the ultra-sleepy modes (as low as 2 kHz), the external memory devices become significant factors in the current consumption unless one of the short or self-timed chip selects are used.

Figure 28-6 shows a typical current draw for the ultra sleepy modes.


Figure 28-6. Typical Current Draw for the Ultra Sleepy Modes

28.5.2 Battery-Backed Clock Current Consumption

For the battery-backed features of the Rabbit 4000 to perform while the processor is powered down, both the VBAT and BATIO pins need to be supplied properly. The VBAT pin powers the internal real-time clock and the battery-backed SRAM, while VBATIO powers the /RESET, /CS1, CLK32K, and RESOUT pins.

Note that the VBATIO pin can be powered at 1.8 V during powerdown even if the processor is running at 3.3 V normally. A circuit to switch between a 1.8–2.0 V battery and the main power can use the RESOUT pin to switch the power source for the VBATIO pin. R is a current-limiting resistor that should be adjusted for the battery voltage; a good value to use for a 2.0 V battery is 150 kohms.


Figure 28-7. Switching Circuit for VATIO Pin

Table 28-12 shows the typical current consumption for these pins while the remainder of the Rabbit 4000 is powered down.

Table 28-12. Typical Battery-Backed Current Consumption
(-40°C to +85°C)

Pin

Voltage

Current

VBAT
1.8 V
1.7 µA
VBATIO
1.8 V
0.1 µA



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