| Smart Star User's Manual |
6. Smart Star Specifications
This chapter provides the specifications for the Smart Star backplane and CPU card, and describes the conformal coating.
6.1 Electrical and Mechanical Specifications
6.1.1 Smart Star Backplane
Figure 19 shows the mechanical dimensions for the two Smart Star backplanes.
NOTE All diagram and graphic measurements are in inches followed by millimeters enclosed in parentheses. Table 3 lists the electrical, mechanical, and environmental specifications for the Smart Star backplanes.
Table 3. Smart Star Backplane Specifications Board Size
6.50" × 4.20" × 0.75"
(165 mm × 107 mm × 19 mm)
3.75" × 4.40" × 0.75"
(95 mm × 112 mm × 19 mm)
Connectors
one 2 × 26 (CPU card slot), 2 mm
seven 2 × 13 (I/O card slots), 2 mm
one 2 × 26 (CPU card slot), 2 mm
three 2 × 13 (I/O card slots), 2 mm
Slot Select
Each slot has a predefined dedicated set of addresses
(see Appendix E and the software chapters in the individual I/O card manuals)
Temperature
-40°C to +70°C
Humidity
5% to 95%, noncondensing
External Input Voltage
9 V to 30 V DC at 1 A typical for onboard +5 V regulated supply; provision for independent 9 V to 30 V DC (V_USER) voltage source for I/O cards--the exact voltage for the second supply depends on the requirements of the specific I/O cards used (Z-World recommends tying V_USER to +RAW unless there is a specific need for an independent power supply)
Onboard Voltage Regulator
Surface-mount switching regulator sources 5 V at 1 A
Data Lines
Buffered bidrirectional data lines (D0-D7)
Address Lines
Buffered address lines (A0-A3)
Read/Write Control
Buffered IORD, IOWR
Reset
I/O cards and CPU card can be reset independently
6.1.2 CPU Card
Figure 20 shows the mechanical dimensions for the CPU cards.
Table 4 lists the electrical, mechanical, and environmental specifications for the CPU card.
6.2 Jumper Configurations
Figure 21 shows the header locations used to configure the various CPU card options via jumpers.
Table 5 lists the configuration options.
Table 5. Smart Star CPU Card Jumper Configurations JP1
RS-485 Bias and Termination Resistors
1-2
5-6
Bias and termination resistors connected
×
1-3
4-6
Bias and termination resistors not connected1
JP2
U5 Flash Memory Size
1-2
128K/256K
×
2-3
512K
JP3
SRAM Size
1-2
128K
×
2-3
512K
JP4
U11 Flash Memory Size
1-2
128K/256K
×
2-3
512K
JP5
Flash Memory Bank Select
1-2
Normal Mode
×
2-3
Bank Mode
1 Although pins 1-3 and 4-6 of header JP1 are shown "jumpered" for the termination and bias resistors not connected, pins 3 and 4 are not actually connected to anything, and this configuration is a "parking" configuration for the jumpers so that they will be readily available should you need to enable the termination and bias resistors in the future.
6.3 Conformal Coating
The areas around the crystal oscillator and the battery backup circuit on the CPU card have had the Dow Corning silicone-based 1-2620 conformal coating applied. The conformally coated areas are shown in Figure 22. The conformal coating protects these high-impedance circuits from the effects of moisture and contaiminants over time.
Any components in the conformally coated area may be replaced using standard soldering procedures for surface-mounted components. A new conformal coating should then be applied to offer continuing protection against the effects of moisture and contaminants.
NOTE For more information on conformal coatings, refer to Rabbit Semiconductor Technical Note 303, Conformal Coatings. 6.4 Use of Rabbit 2000 Parallel Ports
Figure 23 shows the Rabbit 2000 parallel ports.
6.5 Exclusion Zone
It is recommended that you allow for an "exclusion zone" of 3" (80 mm) around the Smart Star in all directions when the Smart Star is incorporated into an assembly that includes other components. This "exclusion zone" that you keep free of other components and boards will allow for sufficient air flow, and will help to minimize any electrical or EMI interference between adjacent boards.
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