RabbitCore RCM3000
User's Manual
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Appendix A. RabbitCore RCM3000 Specifications

Appendix A provides the specifications for the RCM3000, and describes the conformal coating.

A.1 Electrical and Mechanical Characteristics

Figure A-1 shows the mechanical dimensions for the RCM3000.


Figure A-1. RCM3000 Dimensions

Table A-1 provides the pin 1 locations for the RCM3000 headers viewed from the top side (as in Figure A-1).


It is recommended that you allow for an "exclusion zone" of 0.04" (1 mm) around the RCM3000 in all directions when the RCM3000 is incorporated into an assembly that includes other printed circuit boards. This "exclusion zone" that you keep free of other components and boards will allow for sufficient air flow, and will help to minimize any electrical or electromagnetic interference between adjacent boards. An "exclusion zone" of 0.08" (2 mm) is recommended below the RCM3000 when the RCM3000 is plugged into another assembly using the shortest connectors for headers J1 and J2. Figure A-2 shows this "exclusion zone."


Figure A-2. RCM3000 "Exclusion Zone"

Table A-2 lists the electrical, mechanical, and environmental specifications for the RCM3000.


A.1.1 Headers

The RCM3000 uses headers at J1 and J2 for physical connection to other boards. J1 and J2 are 2 ×  17 SMT headers with a 2 mm pin spacing. J3, the programming port, is a 2 ×  5 header with a 2 mm pin spacing.

Figure A-3 shows the layout of another board for the RCM3000 to be plugged into. These values are relative to the mounting hole.

A.1.2 Physical Mounting

A 9/32" (7 mm) standoff with a 2-56 screw is recommended to attach the RCM3000 to a user board at the hole position shown in Figure A-3. Either use plastic hardware, or use insulating washers to keep any metal hardware from shorting out signals on the RCM3000.


Figure A-3. User Board Footprint for RCM3000

A.2 Bus Loading

You must pay careful attention to bus loading when designing an interface to the RCM3000. This section provides bus loading information for external devices.

Table A-3 lists the capacitance for the various RCM3000 I/O ports.


Table A-4 lists the external capacitive bus loading for the various RCM3000 output ports. Be sure to add the loads for the devices you are using in your custom system and verify that they do not exceed the values in Table A-4.


Figure A-4 shows a typical timing diagram for the Rabbit 3000 microprocessor external memory read and write cycles.


Figure A-4. Memory Read and Write Cycles

Table A-5 lists the delays in gross memory access time for several values of VDD.


The measurements are taken at the 50% points under the following conditions.

The clock to address output delays are similar, and apply to the following delays.

The data setup time delays are similar for both Tsetup and Thold.

When the spectrum spreader is enabled with the clock doubler, every other clock cycle is shortened (sometimes lengthened) by a maximum amount given in the table above. The shortening takes place by shortening the high part of the clock. If the doubler is not enabled, then every clock is shortened during the low part of the clock period. The maximum shortening for a pair of clocks combined is shown in the table.

A.3 Rabbit 3000 DC Characteristics

Table A-6 outlines the DC characteristics for the Rabbit at 3.3 V over the recommended operating temperature range from Ta = -55°C to +125°C, VDD = 3.0 V to 3.6 V.


A.4 I/O Buffer Sourcing and Sinking Limit

Unless otherwise specified, the Rabbit I/O buffers are capable of sourcing and sinking 6.8 mA of current per pin at full AC switching speed. Full AC switching assumes a 29.4 MHz CPU clock and capacitive loading on address and data lines of less than 70 pF per pin. The absolute maximum operating voltage on all I/O is 5.5 V.

Table A-7 shows the AC and DC output drive limits of the parallel I/O buffers when the Rabbit 3000 is used in the RCM3000.


Under certain conditions, the maximum instantaneous AC/DC sourcing or sinking current may be greater than the limits outlined in Table A-7. The maximum AC/DC sourcing current can be as high as 12.5 mA per buffer as long as the number of sourcing buffers does not exceed three per VDD or VSS pad, or up to six outputs between pads. Similarly, the maximum AC/DC sinking current can be as high as 8.5 mA per buffer as long as the number of sinking buffers does not exceed three per VDD or VSS pad, or up to six outputs between pads. The VDD bus can handle up to 35 mA, and the VSS bus can handle up to 28 mA. All these analyses were measured at 100°C.

A.5 Conformal Coating

The areas around the 32 kHz real-time clock crystal oscillator has had the Dow Corning silicone-based 1-2620 conformal coating applied. The conformally coated area is shown in Figure A-5. The conformal coating protects these high-impedance circuits from the effects of moisture and contaminants over time.


Figure A-5. RCM3000 Areas Receiving Conformal Coating

Any components in the conformally coated area may be replaced using standard soldering procedures for surface-mounted components. A new conformal coating should then be applied to offer continuing protection against the effects of moisture and contaminants.

NOTE For more information on conformal coatings, refer to Technical Note 303, Conformal Coatings.

A.6 Jumper Configurations

Figure A-6 shows the header locations used to configure the various RCM3000 options via jumpers.


Figure A-6. Location of RCM3000 Configurable Positions

Table A-8 lists the configuration options.


NOTE The jumper connections are made using 0 W surface-mounted resistors.


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